Method of forming an alignment mark

Details Method of forming an alignment mark Method of forming an alignment mark

1998-07-06

2000-07-04

Booth, Richard

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Having substrate registration feature

H01L 2176

Patent

active

06083806&

ABSTRACT:
An alignment mark (51) is formed on the surface (64) of a silicon carbide substrate (50). The alignment mark (51) is used to reflect a light signal (72) to determine the proper position for the silicon carbide substrate (50). The materials that are used to form the alignment mark (51) can be used to form an alignment mark on any transparent or semi-transparent substrate and will maintain physical integrity through very high temperature processing steps.

REFERENCES:
patent: 5042945 (1991-08-01), Shibata et al.
patent: 5144747 (1992-09-01), Eichelberger
patent: 5188876 (1993-02-01), Hensel et al.
patent: 5270222 (1993-12-01), Moslehi
patent: 5506421 (1996-04-01), Palmour
patent: 5553110 (1996-09-01), Sentoku et al.
patent: 5554561 (1996-09-01), Plumton
patent: 5610085 (1997-03-01), Yuan et al.
patent: 5624860 (1997-04-01), Plumton et al.
patent: 5681762 (1997-10-01), Baliga
patent: 5712189 (1998-01-01), Plumton et al.
patent: 5917205 (1999-06-01), Mitsui et al.
patent: 5972793 (1999-10-01), Tseng
patent: 6015750 (2000-01-01), Bruce et al.

Affiliated with

Also associated with

Rating

Method of forming an alignment mark does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming an alignment mark, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming an alignment mark will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1485752