Method of forming an adhesive connection

Details Method of forming an adhesive connection Method of forming an adhesive connection

1998-03-09

2000-06-20

Theisen, Mary Lynn

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

1563096, 29832, 257778, 257782, 257783, H05K 330

Patent

active

060773804

ABSTRACT:
Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.

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