Method of forming aluminum/copper alloy conductors

Details Method of forming aluminum/copper alloy conductors Method of forming aluminum/copper alloy conductors

1980-08-04

1982-06-22

Rutledge, L. Dewayne

Metal working

Method of mechanical manufacture

Electrical device making

29590, 156643, 156652, 156656, 1566591, 156665, 156666, 204192E, 357 67, H01L 21283, H01L 21308

Patent

active

043355064

ABSTRACT:
Aluminum/copper alloy conductors are made by forming a patterned layer of copper on a layer of aluminum. The portion of the aluminum layer which is not protected by the copper layer is removed by reactive ion etching and the resulting structure is then heated to cause the copper to diffuse into, and alloy with the aluminum layer.

REFERENCES:
patent: 3615951 (1971-10-01), Franco et al.
patent: 3654108 (1972-04-01), Smith
patent: 3725309 (1973-04-01), Ames et al.
patent: 3873361 (1975-03-01), Franco et al.
patent: 3879840 (1975-04-01), Ames et al.
patent: 3881884 (1975-05-01), Cook et al.
patent: 3918149 (1975-11-01), Roberts
patent: 3994793 (1976-11-01), Harvilchuck et al.
patent: 4004044 (1977-01-01), Franco et al.
Hatzakis, M. et al., Forming a Sputter Etching Mask, IBM Technical Disclosure Bulletin, 12 (11), Apr. 1970.
Schaible, P. M. et al., Reactive Ion Etching of Aluminum and Aluminum Alloys in an RF Plasma Containing Halogen Species, in J. Vacuum Sci. & Tech., 15 (2) pp. 334-337, Mar./Apr. 1978.
Schaible, P. M., et al., Reactive Ion Etching of Aluminum and Aluminum Alloys, IBM Tech. Disc. Bul. 21 (4), Sep. 1978.

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