Method of forming a wiring layer

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437228, 437229, 15665911, H01L 2128, H01L 2131

Patent

active

055146252

ABSTRACT:
A novolak-based resist layer is formed on an interlayer insulating film, and that portion of the resist layer which is left as a resist mask for a wiring layer groove is formed by the first exposure and the heat treatment in an ammonia atmosphere. Thus, the solution rate of that portion of the resist layer is rendered low with regard to the alkali developing solution. Subsequently, the resist layer is exposed and developed in a regular manner to form a resist mask for defining a contact hole. With the obtained resist pattern used as a mask, the interlayer insulating film is etched to a depth which equals to a length of a contact hole in the depth direction formed at a later step. After that, with use of the resist pattern whose solution rate with respect to the alkali developing solution has been made low as a mask, the wiring layer groove is formed. With the method, a mask resist pattern used for defining a contact hole can be formed in a predetermined region, even if the exposure of the resist layer is displaced from the position where it should have been. Further, no step portion is created between the contact hole and the wiring groove.

REFERENCES:
patent: 4985374 (1991-01-01), Tsuji et al.
patent: 4999318 (1991-03-01), Takahumi et al.
patent: 5055426 (1991-10-01), Manning
patent: 5126006 (1992-06-01), Cronin et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming a wiring layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming a wiring layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a wiring layer will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1227059

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.