Method of forming a welded encasement for a computer card

Details Method of forming a welded encasement for a computer card Method of forming a welded encasement for a computer card

1994-07-01

1996-04-02

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29DIG29, 174 521, 257679, 361684, 361737, 439 761, H05K 504, H01L 2158

Patent

active

055028926

ABSTRACT:
A method of forming a module includes positioning a circuit card, such as a memory card, between separate frameworks and welding the frameworks together to encase the circuit card. The frameworks are preferably welded using sonic wave energy, thereby further enhancing the structural strength of the assembly. The assembly also includes cover and base panels. The panels are bent to further enhance the structural strength. In the preferred embodiment, the frameworks are injection molded onto the panels.

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Granberry "How to Package and Interconnect with Microstrip" 1970 IEEE International Convention Digest, New York, S016000060 pp. 434-435.

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