Method of forming a three-dimensional integrated inductor

Details Method of forming a three-dimensional integrated inductor Method of forming a three-dimensional integrated inductor

1998-04-09

1999-12-28

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Making passive device

257531, 336200, 296021, H01L 2900

Patent

active

060081023

ABSTRACT:
A three-dimensional inductor coil is fabricated on top of a semiconductor substrate. The fabrication process includes the steps of depositing a first photoresist layer (406), forming a trench therein, and filling the trench with electroplated metal (404). A second photoresist layer (408) is deposited, and first and second trenches (410) are formed therein and filled with electroplated metal (412). A third photoresist layer (416) is deposited and a trench (418) formed therein, and then filled with electroplated metal (420). The first, second, and third photoresist layers (406, 408, 416) are then removed to expose a multi-loop inductor coil (500, 550).

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