Method of forming a thick film dielectric layer in an...

Details Method of forming a thick film dielectric layer in an... Method of forming a thick film dielectric layer in an...

2005-05-03

2008-09-23

Meeks, Timothy (Department: 1792)

Coating processes

Electrical product produced

Fluorescent or phosphorescent base coating

C427S369000, C427S372200, C427S419200, C427S541000

Reexamination Certificate

active

07427422

ABSTRACT:
The invention provides a method of forming a thick film dielectric layer in an EL laminate of the type including one or more phosphor layers sandwiched between a front and a rear electrode with the phosphor layer being separated from the rear electrode by a thick film dielectric layer. The method includes depositing a ceramic material in one or more layers by a thick film technique to form a dielectric layer having a thickness of 10 to 300 μm; pressing the dielectric layer to form a densified layer with reduced porosity and surface roughness; and sintering the dielectric layer to form a pressed, sintered dielectric layer which, in an EL laminate, has an improved uniform luminosity over an unpressed, sintered dielectric layer of the same composition.

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Parodos, T., Maruska, H.P., Halverson, W., B

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