Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate
2011-01-11
2011-01-11
Del Sole, Joseph S (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
Mechanical shaping or molding to form or reform shaped article
To produce composite, plural part or multilayered article
C623S901000, C249S061000, C249S055000, C249S141000, C249S168000
Reexamination Certificate
active
07867426
ABSTRACT:
A mold assembly and method of forming a surgical implant from bone cement. The method has the steps of connecting a plurality of mold segments to approximate the size of a patient implant. Each mold segment has an open channel. The method may further include aligning the channels of connected mold segments, positioning a centralizing holder on a reinforcement member, mixing bone cement, pouring at least some bone cement through the channels and into connected mold segments, fitting the reinforcement member into the mold segments, curing the bone cement; and removing the cured surgical implant.
REFERENCES:
patent: 5658516 (1997-08-01), Eppley et al.
patent: 5997582 (1999-12-01), Weiss
patent: 6155812 (2000-12-01), Smith et al.
patent: 6361731 (2002-03-01), Smith et al.
patent: 6561783 (2003-05-01), Hsu
patent: 6656143 (2003-12-01), Browd
patent: 6942475 (2005-09-01), Ensign et al.
patent: 2003/0021861 (2003-01-01), Yamada
patent: 2005/0119756 (2005-06-01), Soffiati
Whiteside Joseph W.
Ziran Bruce H.
Del Sole Joseph S
Herberger Robert J.
Robitaille John P
Topolosky Gary P.
LandOfFree
Method of forming a temporary implant does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming a temporary implant, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a temporary implant will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2701438