Method of forming a T shaped control electrode through an X-ray

Radiation imagery chemistry: process – composition – or product th – Radiation modifying product or process of making – Radiation mask

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430296, 430323, 430324, 378 35, G03F 102

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048957798

ABSTRACT:
A positive resist film is formed on the major surface of a semiconductor substrate, to be irradiated with X-rays through an X-ray mask. The X-ray mask is formed by a joined member of an X-ray transmittable substrate and an X-ray absorber, and the X-ray absorber has an opening section of a T shape, in order to change the amount of transmission of the X-rays in desired positions. After the irradiation with the X-rays, the positive resist film is developed to obtain a resist film having an opening section of a desired T shape. A film for providing a control electrode is formed in the opening section of the resist film and the resist film is removed, thereby to form a T-shaped control electrode on the semiconductor substrate.

REFERENCES:
Queisser, X-Ray Optics, Springer-Verlag, Berlin Heidelberg, New York, 1977.
RD#27433, Research Disclosure, Feb. 1987, No. 274, Kenneth Mason Publications Ltd., England.
Y. Todokoro, "Double Layer Resist Films for Submicrometer Electron Beam Lithography", IEEE, V. ED-27, No. 8, pp. 1443-1448, Aug. 1980.
Y. Todokoro et al., "Formation of a T-shaped Gate Through Electron Beam Exposure", Japanese Society of Applied Physics, 1979, 2P-A-4.
H. Matsumura et al., "Submicrometer Lift-Off Line With T-Shaped Cross Sectional Form", Electronics Letters, vol. 17, No. 12, pp. 429-430, Jun. 1981.
Muller et al., "Synchrotron Lithography for Sub-Half-Micron T-Gates in GaAs-FETS", 1986, Microcircuit Engineering.
Takahashi et al., "A Half-Micron Gate GAAS FET Fabricated by Chemical Dry Etching", 1977, Japanese Journal of Applied Physics, vol. 16, Supplement 16-1, pp. 115-118.

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