Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent
1998-10-01
1999-12-28
Bowers, Charles
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
438112, 257685, 257707, 257790, H01L 2144, H01L 2148, H01L 2150
Patent
active
060080744
ABSTRACT:
The present invention includes integrated circuit devices, synchronous-link dynamic random access memory devices, methods of forming an integrated circuit device and methods of forming a synchronous-link dynamic random access memory edge-mounted device. According to one aspect of the present invention, an integrated circuit device includes a semiconductor die and a first housing encapsulating the semiconductor die. A heat sink is positioned proximate the first housing and a second housing is formed to encapsulate at least a portion of the heat sink. The heat sink is preferably thermally coupled with the semiconductor die and configured to expel heat therefrom. Another aspect provides a method of forming an integrated circuit device including the steps of providing a semiconductor die; forming a first housing about the semiconductor die; thermally coupling a heat sink with the first housing; and forming a second housing about at least a portion of the heat sink following the thermally coupling.
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Berezny Nema
Bowers Charles
Micro)n Technology, Inc.
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