Metal working – Piezoelectric device making
Reexamination Certificate
2007-05-08
2007-05-08
Tugbang, A. Dexter (Department: 3729)
Metal working
Piezoelectric device making
C029S594000, C029S846000, C029S847000, C310S31300R, C333S193000
Reexamination Certificate
active
11428924
ABSTRACT:
A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.
REFERENCES:
patent: 4037176 (1977-07-01), Ono et al.
patent: 5215546 (1993-06-01), Cho et al.
patent: 5446330 (1995-08-01), Eda et al.
patent: 5448126 (1995-09-01), Eda et al.
patent: 5469170 (1995-11-01), Mariani
patent: 5896636 (1999-04-01), Penunuri
patent: 5998907 (1999-12-01), Taguchi et al.
patent: 6424238 (2002-07-01), Penunuri
patent: 6570470 (2003-05-01), Maehara et al.
Kazuhiko, Yamanouchi; SAW Properties of Si02/128° Y-X LiNb03 Structure Fabricated by Magnetron Sputtering Technique;IEEE Transactions on Sonics and Ultrasonics, vol. SU-31, No. 1, Jan. 1984; pp. 51-57.
Kiyoshi, Nakamura; Effect of a Ferroelectric Inversion Layer on the Temperature Characteristics of SH-Type Surface Acoustic Waves on 36° Y-X LiTa03 Substrates;IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, vol. 41, No. 6, Nov. 1994; pp. 872-875.
T.E. Parker; Stability of SAW Controlled Oscillators; 1975 Ultrasonics Symposium Proceedings, IEEE Cat. No. 75 CHO 994-4SU; pp. 261-263.
Abbott Benjamin P.
Chocola Jack
Malocha Svetlana
Monetti Gary
Zepess Joshua M.
Allen Dyer Doppelt Milbrath & Gilchrist, P.A.
Nguyen Tai Van
Triquint, Inc.
Tugbang A. Dexter
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