Method of forming a stacked device filler

Details Method of forming a stacked device filler Method of forming a stacked device filler

2008-01-22

2008-01-22

Coleman, William D. (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S456000

Reexamination Certificate

active

07320928

ABSTRACT:
Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between two or more substrates of a stacked device, and causing a reaction in at least a portion of the material, wherein the reaction may comprise polymerization, and the material layer may be one or a combination of materials, such as nonconductive polymer materials, for example.

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