Method of forming a sputtering target assembly and assembly...

Details Method of forming a sputtering target assembly and assembly... Method of forming a sputtering target assembly and assembly...

2003-10-21

2008-12-23

McDonald, Rodney G (Department: 1795)

Metal fusion bonding

Process

Using dynamic frictional energy

C228S112100, C228S115000, C228S116000, C228S136000, C228S164000, C228S166000, C228S167000, C228S168000, C228S171000, C228S173200, C228S165000, C228S193000, C228S194000, C228S195000, C204S298120, C204S198001

Reexamination Certificate

active

07467741

ABSTRACT:
A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method includes bonding a sputtering target to a backing plate at a low temperature. Also described is a method of forming a sputtering target assembly such that a gap is formed between the sputtering target and the backing plate. Also described is a method of forming a sputtering target assembly providing a mechanism to prevent unintended sputtering into the backing plate.

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