Method of forming a solder interconnection capable of sustained

Details Method of forming a solder interconnection capable of sustained Method of forming a solder interconnection capable of sustained

1981-05-08

1982-11-23

Goldberg, Howard N.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228124, 228254, B23K 3102

Patent

active

043601421

ABSTRACT:
A process for forming ball limiting metallurgy pad structure for a semiconductor device solder bond interconnection comprising:

REFERENCES:
patent: 3495133 (1970-02-01), Miller
patent: 3706015 (1972-12-01), Schimmer et al.
patent: 3741242 (1973-06-01), Aakalu et al.
patent: 3839727 (1974-10-01), Herdzik et al.
patent: 3881884 (1975-05-01), Cook et al.
patent: 3993123 (1976-11-01), Chu et al.
Manko, H. H., Solders and Soldering, N.Y., McGraw-Hill, 1964, pp. 100-104.
Totta, P. and Sopher, R. "SLT Device Metallurgy and Its Monolithic Extension," IBM Journal of Research and Development, vol. 13, No. 3, (May 1969), pp. 226-238.

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