Method of forming a semiconductor package and structure...

Details Method of forming a semiconductor package and structure... Method of forming a semiconductor package and structure...

2011-05-03

2011-05-03

Maldonado, Julio J (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S108000, C257S670000, C257S676000, C257SE23043, C257SE23050, C257SE23052

Reexamination Certificate

active

07935575

ABSTRACT:
In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.

REFERENCES:
patent: 6081031 (2000-06-01), Letterman, Jr. et al.
patent: 7777315 (2010-08-01), Noquil
patent: 7812437 (2010-10-01), Noquil et al.
patent: 2004/0262781 (2004-12-01), Germain et al.
patent: 2006/0108671 (2006-05-01), Kasem et al.

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