Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1998-03-03
2000-08-08
Garrett, Felisa
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438712, 438715, 438723, H01L 21302, H01L 21461
Patent
active
061002011
ABSTRACT:
A method of forming a capacitor by forming a dielectric layer over a bottom electrode layer, forming a top electrode layer over the dielectric layer to form laminations of the bottom electrode layer, the dielectric layer and the top electrode layer, and selectively etching the laminations to form a capacitor, the dielectric layer being etched by a reactive ion etching so that the dielectric layer of the capacitor receives no substantive damage in the etching process.
REFERENCES:
patent: 4444618 (1984-04-01), Saia et al.
patent: 5304514 (1994-04-01), Nishibe et al.
patent: 5396093 (1995-03-01), Lu
patent: 5443688 (1995-08-01), Toure et al.
patent: 5449934 (1995-09-01), Shono et al.
patent: 5518962 (1996-05-01), Murao
patent: 5638319 (1997-06-01), Onishi et al.
patent: 5776356 (1998-07-01), Yokoyama
patent: 5851841 (1998-12-01), Ushikubo et al.
patent: 5854104 (1998-12-01), Onishi et al.
patent: 5854499 (1998-12-01), Nishioka
Hayashi Yoshihiro
Kawahara Jun
Maejima Yukihiko
Saitoh Shinobu
Deo Duy-Vu
Garrett Felisa
NEC Corporation
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