Method of forming a semiconductor die with heat and...

Details Method of forming a semiconductor die with heat and... Method of forming a semiconductor die with heat and...

2008-03-04

2008-03-04

Tran, Lonh K. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S214000, C438S280000, C257S276000, C257SE23051, C257SE23101, C257SE33075

Reexamination Certificate

active

07338840

ABSTRACT:
Thermal hot spots in the substrate of a semiconductor die, and the required surface area of the semiconductor die, are substantially reduced by forming thermal or thermal and electrical pipes in the substrate that extend from a bottom surface of the substrate to a point near the top surface of the substrate.

REFERENCES:
patent: 6110825 (2000-08-01), Mastromatteo et al.
patent: 6249136 (2001-06-01), Maley
patent: 6677235 (2004-01-01), Yegnashankaran et al.
patent: 2004/0152240 (2004-08-01), Dangelo

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