Semiconductor device manufacturing: process – Semiconductor substrate dicing – By electromagnetic irradiation
Reexamination Certificate
2007-07-10
2007-07-10
Smith, Zandra V (Department: 2822)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
By electromagnetic irradiation
C438S460000, C438S462000, C438S464000, C438S940000, C219S121670
Reexamination Certificate
active
10887662
ABSTRACT:
A method of forming a scribe line having a sharp snap line entails directing a UV laser beam along a ceramic or ceramic-like substrate such that a portion of the thickness of the substrate is removed. The UV laser beam forms a scribe line in the substrate without appreciable substrate melting so that a clearly defined snap line forms a region of high stress concentration extending into the thickness of the substrate. Consequently, multiple depthwise cracks propagate into the thickness of the substrate in the region of high stress concentration in response to a breakage force applied to either side of the scribe line to effect clean fracture of the substrate into separate circuit components. The formation of this region facilitates higher precision fracture of the substrate while maintaining the integrity of the interior structure of each component during and after application of the breakage force.
REFERENCES:
patent: 5961852 (1999-10-01), Rafla-Yuan et al.
patent: 6117347 (2000-09-01), Ishida
patent: 6140603 (2000-10-01), Hwang et al.
patent: 6309943 (2001-10-01), Glenn et al.
patent: 6413839 (2002-07-01), Brown et al.
patent: 6420245 (2002-07-01), Manor
patent: 6420776 (2002-07-01), Glenn et al.
patent: 6580054 (2003-06-01), Liu et al.
patent: 6676878 (2004-01-01), O'Brien et al.
patent: 6787732 (2004-09-01), Xuan et al.
patent: 6788545 (2004-09-01), Nakayama
patent: 2002/0033558 (2002-03-01), Fahey et al.
patent: 2002/0063361 (2002-05-01), Fahey
patent: 2005/0263854 (2005-12-01), Shelton et al.
patent: WO 02024395 (2002-03-01), None
patent: WO 02060636 (2002-08-01), None
patent: WO 03002289 (2003-01-01), None
Park, Jongkook and Sercel, Patrick, “High-speed UV laser scribing boosts blue LED industry,” Compoundsemiconductor.net magazine, posted on Dec. 2002 (available at www.compoundsemiconductor.net/magazine/article/8/12/3/1) (last visited Jul. 10, 2003).
D. H. Schroeder and F. L. English, “A Comparison of the Strength of Alumina Substrates for Different Separation Techniques,” from 1972 Components Conference Proceedings, Microcircuit Technology Division, pp. 412-415.
Anklekar Rupendra M.
Garcia Doug
Johnson Jay Christopher
Sammi Manoj Kumar
Sun Yunlong
Electro Scientific Industries Inc.
Novacek Christy
Smith Zandra V
Stoel Rives LLP
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