Method of forming a resin cover lens of LED assembly

Details Method of forming a resin cover lens of LED assembly Method of forming a resin cover lens of LED assembly

2011-04-12

2011-04-12

Dickey, Thomas L (Department: 2893)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C257SE33067

Reexamination Certificate

active

07923272

ABSTRACT:
A method of forming the resin cover lens of LED assembly uses transparent materials, such as plastics, PP (Polypropylene), PET (Polyethylene teraphthalate), PC (Polycarbonate), PE (Polyethylene) or glass to produce the mold for making lens; and uses liquid transparent resin that can be quickly cured under EB (electron-beam) radiation, such as PU (Polyurethane), epoxy, silicon, acrylic resin or its copolymer et al., or the above resin added with photo initiator and curable under UV radiation; and fills in the mold cavity with the resin; and selects EB or UV to cure the liquid transparent resin inside the cavity to form lens. The new process in the invention is to reduce the curing time for making lens that helps LED assembly achieve high throughput rate and mass production.

REFERENCES:
patent: 6140438 (2000-10-01), Ojio et al.
patent: 2004/0014397 (2004-01-01), Tyldesley
patent: 2006/0017860 (2006-01-01), Adachi et al.
patent: 2008/0079182 (2008-04-01), Thompson et al.

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