Method of forming a projection electrode

Details Method of forming a projection electrode Method of forming a projection electrode

2005-05-17

2005-05-17

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S829000, C029S842000, C029S874000, C029S884000, C438S017000, C438S673000, C438S701000, C438S613000, C438S669000, C438S745000, C438S754000, C257S775000, C216S011000, C205S667000

Reexamination Certificate

active

06892452

ABSTRACT:
A Dry-Film resist formed of, for example, a photosensitive film is stacked on the electroconductive material and these portions, other than a projection electrode formation area, formed on a wiring board's electrode serving as a portion of a circuit pattern are masked with a mask. After this, the wiring board is exposed to light and, after the removal of the mask, a development process is performed, thus eliminating the Dry-Film resist on the wiring board at the portion other than the projection electrode formation area. Then the electroconductive material of the wiring board is etched under an etching process to provide a projection electrode having a bump with a pointed tapering end in vertical cross-section. Finally, the wiring board is exposed to a Dry-Film resist elimination solution to remove remaining Dry-Film resist from the projection electrode. And a plating process is performed on the electroconductive material to form a plated layer and hence complete the projection electrode.

REFERENCES:
patent: 4952272 (1990-08-01), Okino et al.
patent: 5105537 (1992-04-01), Datta et al.
patent: 5686317 (1997-11-01), Akram et al.
patent: 5-55306 (1993-03-01), None
English language Abstract, JP 5-55306. Mar. 5, 1993.

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