Method of forming a printhead using a silicon on insulator...

Details Method of forming a printhead using a silicon on insulator... Method of forming a printhead using a silicon on insulator...

2005-09-06

2005-09-06

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Fluid pattern dispersing device making, e.g., ink jet

C029S611000, C438S021000, C438S749000, C216S027000, C216S079000, C216S099000

Reexamination Certificate

active

06938340

ABSTRACT:
Described herein is a method of forming a printhead. A silicon-on-insulator (SOI) substrate, including a first silicon layer, a second silicon layer, and an oxide layer between the first silicon layer and the second silicon layer, is provided. A plurality of thin film layers is formed on a first surface of the substrate. At least one of the layers forms a plurality of ink ejection elements. Ink feed holes are formed through the thin film layers. An opening is formed in the substrate by (a) etching the first silicon layer of the SOI substrate using a wet etch to etch a trench in the first silicon layer extending to the oxide layer; (b) etching an opening in the oxide layer; and (c) etching an opening in the second silicon layer to form an ink path between a backside of the SOI substrate and a topside of the SOI substrate.

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