Method of forming a printhead

Details Method of forming a printhead Method of forming a printhead

2006-07-27

2009-06-23

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Fluid pattern dispersing device making, e.g., ink jet

C029S890090, C347S063000, C216S027000

Reexamination Certificate

active

07549225

ABSTRACT:
A method of bonding two semiconductor substrates to form a printhead includes aligning a top surface of a first substrate with a second substrate, wherein the first substrate has a fluid channel in the top surface, heating the first and second substrates to a first temperature in a partial vacuum, and placing the top surface of the first substrate in contact with the second substrate to form a bond.

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US Patent Application Titled: “Fully Integrated Printhead Using Silicon On Insulator Wafer”; U.S. Appl. No. 09/654,869; filed Sep. 5, 2000; Haluzak et al.

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