Method of forming a polishing pad with reduced stress window

Details Method of forming a polishing pad with reduced stress window Method of forming a polishing pad with reduced stress window

2006-03-28

2006-03-28

Lee, Edmund H. (Department: 1732)

Plastic and nonmetallic article shaping or treating: processes

Disparate treatment of article subsequent to working,...

Effecting temperature change

C264S275000, C264S271100, C264S279000, C264S346000

Reexamination Certificate

active

07018581

ABSTRACT:
The present invention provides a chemical mechanical polishing pad having reduced stress windows. In addition, the present invention provides a method of forming a chemical mechanical polishing pad, the method comprising, primary annealing a window separate from a polishing pad material and providing the polishing pad material in a periphery of the primary annealed window before a predetermined quench temperature of the primary annealed window. The method further comprises secondary annealing the window and the polishing pad material together and cutting the secondary annealed window and the polishing pad material to a predetermined thickness.

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