Metal working – Method of mechanical manufacture – Electrical device making
Patent
1990-01-26
1991-10-15
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29739, 29830, 174263, 2281802, 361411, 428901, H01R 909
Patent
active
050562169
ABSTRACT:
A solder interconnection for forming vias between first and second substrates comprises a plurality of solder containing wells extending into a flat surface of the first substrate, the solder in each well being soldered to one of a corresponding plurality of conductor posts extending outwardly from a flat surface of the second substrate. The plurality of the wells are created in a pattern, an aliquot of solder is deposited in each well, with the aliquots being of substantially no greater volume than that of the well it occupies, the posts are provided in aligned array with the pattern, the solder is melted, the posts are inserted and the solder solidifies. Very closely placed vias can be formed.
REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3495133 (1970-02-01), Miller
patent: 4074342 (1978-02-01), Honn et al.
patent: 4349862 (1982-09-01), Bajorek et al.
patent: 4661192 (1987-04-01), McShane
patent: 4818728 (1989-04-01), Rai et al.
IBM Tech. Disclosure Bull., vol. 19, No. 9, Feb. 1977, pp. 3325-3326 by J. D. Larnerd.
IBM Tech. Disclosure Bull. vol. 21, No. 7, Dec. 1978, pp. 2707-2708 by C. S. K. Ng.
Gaisford Scott
Madou Marc J.
Arbes Carl J.
SRI - International
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