Method of forming a plating layer on ceramic chip surfaces and e

Details Method of forming a plating layer on ceramic chip surfaces and e Method of forming a plating layer on ceramic chip surfaces and e

1988-12-15

1990-06-19

Ryan, Patrick

Stock material or miscellaneous articles

Composite

Of metal

428426, 428433, 428901, 427 46, 427 96, 427 98, 427305, 204 51, 204DIG13, B32B 900

Patent

active

049353055

ABSTRACT:
This invention relates to a method of forming a plating layer on ceramic chip surfaces by electroless plating, and to electronic parts manufactured by this method. Such electronic parts include a metal film fixed resistor, a capacitor, a resistor for sensing purposes and a patterned substrate, for example. Ceramic chips are immersed in a plating solution containing chromium chloride, nickel sulfide, sodium hypophosphite, a chelating agent and thiourea. Then each ceramic chip is coated with a plating layer by electroless nickel plating while adjusting pH value of the plating solution with a pH regulating liquid. The resulting electronic parts have an initial resistance of 0.02 to 100 ohm or more and a temperature coefficient of resistance of a two-digit figure or less in ppm.

REFERENCES:
patent: 3985916 (1976-10-01), Church et al.
patent: 4167460 (1979-09-01), Tomaszewski
patent: 4184929 (1980-01-01), Tomaszewski et al.
patent: 4392922 (1983-07-01), Tomaszewski
patent: 4417955 (1983-11-01), Barclay et al.

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