Method of forming a plating layer of a lead frame

Details Method of forming a plating layer of a lead frame Method of forming a plating layer of a lead frame

1997-10-17

2000-01-25

Niebling, John F.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

205227, 205228, 205224, 438115, H01L 2144, H01L 2148, H01L 2150

Patent

active

060177772

ABSTRACT:
A method for forming a plating layer of a lead frame having excellent anti-corrosion properties is provided. At least a portion of a lead frame is plated, then a first heating of the plated portion of the lead frame to a first temperature is performed, and finally a second heating of the first heated plated portion of the lead frame to a second temperature higher than the first temperature is performed. The lead frame manufactured by this method has excellent anti-corrosion properties, such that deterioration of the plating layer, by cracking and inferior solderability, is not observed.

REFERENCES:
patent: 4765528 (1988-08-01), Sekibata et al.
patent: 5151167 (1992-09-01), Truong et al.

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