Method of forming a plasma sprayed interconnection layer on an e

Details Method of forming a plasma sprayed interconnection layer on an e Method of forming a plasma sprayed interconnection layer on an e

1994-02-14

1995-06-20

Skapars, Anthony

Chemistry: electrical current producing apparatus, product, and

With pressure equalizing means for liquid immersion operation

429 31, 429 33, 296235, 427115, 427446, H01M 812, B05D 512

Patent

active

054260035

ABSTRACT:
A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an air electrode structure of an electrochemical cell by (A) providing an electrode surface; (B) forming on a selected portion of the electrode surface, a layer of doped LaCrO.sub.3 particles doped with an element selected from Ca, Sr, Ba, Mg, Co, Ni, Al and mixtures thereof by plasma spraying doped LaCrO.sub.3 powder, preferably compensated with chromium as Cr.sub.2 O.sub.3 and/or dopant element, preferably by plasma arc spraying; and, (C) heating the doped and compensated LaCrO.sub.3 layer to about 1100.degree. C. to 1300.degree. C. to provide a dense, substantially gas-tight, substantially hydration-free, electrically conductive interconnection material bonded to the electrode surface. A solid electrolyte layer can be applied to the unselected portion of the air electrode, and a fuel electrode can be applied to the solid electrolyte, to provide an electrochemical cell.

REFERENCES:
patent: 3330697 (1963-08-01), Pechini
patent: 3630968 (1971-12-01), Hamano et al.
patent: 3823302 (1974-07-01), Muehlberger
patent: 3839618 (1974-10-01), Muehlberger
patent: 4049841 (1977-09-01), Coker et al.
patent: 4128776 (1978-12-01), Boquist et al.
patent: 4180484 (1979-12-01), Marchant
patent: 4430588 (1984-02-01), Way et al.
patent: 4490444 (1984-12-01), Isenberg
patent: 4504522 (1985-03-01), Kaiser et al.
patent: 4557943 (1985-12-01), Rosler et al.
patent: 4597170 (1986-01-01), Isenberg
patent: 4598467 (1986-07-01), Isenberg et al.
patent: 4608232 (1986-08-01), Sunano et al.
patent: 4609562 (1986-09-01), Isenberg et al.
patent: 4629537 (1986-12-01), Hsu
patent: 4686158 (1987-08-01), Nishi et al.
patent: 4697165 (1987-09-01), Ishiquro et al.
patent: 4857420 (1989-08-01), Maricle et al.
patent: 4861345 (1989-08-01), Bowker et al.
patent: 4880670 (1989-11-01), Erbil
patent: 4895576 (1990-01-01), Pal et al.
patent: 4927670 (1990-05-01), Erbil
patent: 4965090 (1990-10-01), Gartner et al.
patent: 4988539 (1991-01-01), Breuil et al.
patent: 5021259 (1991-06-01), Singelyn
patent: 5039840 (1991-08-01), Boardman
patent: 5051321 (1991-09-01), Kitagawa et al.
patent: 5080689 (1992-01-01), Pal et al.
patent: 5085742 (1992-02-01), Dollard et al.
patent: 5132352 (1992-07-01), Richards et al.

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