Method of forming a plasma polymerized film

Details Method of forming a plasma polymerized film Method of forming a plasma polymerized film

1994-11-17

1996-02-27

Pianalto, Bernard

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

427294, 427493, 427571, 427574, 427578, 427585, 427598, C08J 718

Patent

active

054947120

ABSTRACT:
A method of preparing a coated substrate is disclosed. The substrate is coated with a plasma generated polymer containing Si, O, C and H in specific atom ratio wherein the polymer also contains certain functional groups. A power density of about 10.sup.6 to about 10.sup.8 J/Kg is employed in the plasma polymerization process.

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