Method of forming a pattern of conductor runs on a sheet of diel

Details Method of forming a pattern of conductor runs on a sheet of diel Method of forming a pattern of conductor runs on a sheet of diel

1988-05-23

1989-12-26

Page, Thurman K.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156233, 156234, 1562728, 219216, C03B 2900

Patent

active

048895733

ABSTRACT:
A pattern of conductor runs is formed on a sheet of dielectric material using a carrier foil having a coating material adhered to one main surface thereof. The coating material contains particles of metal. The carrier foil is placed with its coated surface in contact with the sheet. The coating material is detached from the carrier foil over selected areas of its coated surface, and the detached coating material is adhered to the sheet.

REFERENCES:
patent: 2747977 (1956-05-01), Eisler
patent: 2776235 (1957-01-01), Peck
patent: 3770529 (1973-11-01), Anderson
patent: 4215170 (1980-07-01), Villaprinyo Oliva
patent: 4465538 (1984-08-01), Schmoock
patent: 4597815 (1986-07-01), Nakamura
patent: 4710253 (1917-12-01), Soszek

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