Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-03-23
1997-08-26
Sough, Hyung S.
Metal working
Method of mechanical manufacture
Electrical device making
257666, 257672, 438 51, H01R 4300
Patent
active
056599501
ABSTRACT:
A method of forming a package assembly (10) including a package (12) that encapsulates an electronic die. A leadframe (30) has edge rails (32), and the die is disposed on the leadframe. The package is formed around the die to encapsulate it, and the leadframe is trimmed to provide a plurality of leads (14) protruding from a first side of the package. This trimming also provides a support (16) connected to a second side of the package. The support is bent to be substantially orthogonal to the common plane containing the leads. A mounting tip (26) on the support is thus disposed outside of the common plane. This support improves the rigidity and natural bending frequency of the package assembly.
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Binder et al., "Anforderungen an Das Packaging Von KFZ-Sensoren", Technisches Messen TM, vol. 56, No. 11, Nov. 1989, pp. 444-453.
Adams Victor J.
Dougherty David J.
Motorola Inc.
Neel Bruce T.
Sough Hyung S.
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