Method of forming a number of solder layers on a semiconductor w

Details Method of forming a number of solder layers on a semiconductor w Method of forming a number of solder layers on a semiconductor w

1983-02-07

1985-03-12

Hearn, Brian E.

Metal working

Plural diverse manufacturing apparatus including means for...

Common reciprocating support for spaced tools

29591, 219 85R, 219 85E, 219 85M, 228212, 357 68, H01L 2100

Patent

active

045035970

ABSTRACT:
A method of forming a number of discrete solder layers on a semiconductor wafer of a large area. A number of regions which are easy to be wetted with solder are formed on one of the major surfaces of the wafer. A solder foil is positioned on the one major surface and a plate-like jig including a plate and projections formed on one surface thereof is disposed on the solder foil with the projections facing the latter. By heating the stacked assembly at a sufficiently high temperature for the solder foil to be molten, a number of the discrete solder layers having a uniform thickness are formed on the semiconductor wafer.

REFERENCES:
patent: 3106014 (1963-10-01), Brick et al.
patent: 3112388 (1963-11-01), Wiant
Koop et al., IBM Tech. Disc. Bull., vol. 13, No. 8, Jan. 1971, "Etched Braze Preform Sheet".
Herdzik et al., IBM Tech. Disc. Bull., vol. 22, No. 3, Aug. 1979, "Method to Change Solder Composition of Chip".

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