Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1987-06-01
1989-03-14
Cashion, Jr., Merrell C.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156247, 156249, 156344, B32B 3100, B44C 302
Patent
active
048121916
ABSTRACT:
A method of fabricating a high density electrical interconnection member by forming a composite interconnection from metallic conductors on cured liquid polymer resin on substrate. The resin is cured at an elevated temperature to form a solid dielectric layer. Successive metallic and dielectric layers form an interconnection subassembly with the coefficient of thermal expansion of the substrate being less than the subassembly. The temperature of the subassembly is lowered placing it in tension. A support member is adhered to the exposed surface of the subassembly and the substrate removed. Multiple subassemblies can be joined together physically and electricaly to form a complex device for interconnecting a plurality of integrated circuit chips for high performance computer applications.
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Ho Chung W.
Min B. Y.
Cashion Jr. Merrell C.
Digital Equipment Corporation
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