Method of forming a mounting structure on a tape carrier

Details Method of forming a mounting structure on a tape carrier Method of forming a mounting structure on a tape carrier

1993-10-19

1995-06-27

Ryan, Patrick J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156250, 156251, 156254, 437205, 437209, 437206, B32B 3100

Patent

active

054276411

ABSTRACT:
A tape carrier for electronic components is provided with enlarged regions along cut out lines defining the boundaries of the electronic component mount area. Provision is made for temporarily maintaining the cut out mount area substantially coplanar with remaining portions of the tape carrier. In the preferred embodiment, this is accomplished by way of an adhesive tape bridging the enlarged openings or by tabs or micro connectors bridging the enlarged openings. Thereafter, the mounts can be totally removed from the carrier film by severing the tape or the tabs. The enlarged regions facilitate the severance of the tape or tabs in an automated assembly line environment.

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