Method of forming a moisture guard ring for integrated circuit a

Details Method of forming a moisture guard ring for integrated circuit a Method of forming a moisture guard ring for integrated circuit a

1995-09-05

1996-07-23

Dang, Trung

Fishing, trapping, and vermin destroying

437195, 437191, 437193, 437922, 148DIG55, H01L 21465

Patent

active

055389244

ABSTRACT:
An improved structure and method for forming an integrated circuit guard ring which prevents contamination/moisture from diffusing through a fuse opening, in the insulating layer(s), to device areas, is described. A first insulating layer is formed over portions of the substrate. A gate insulating layer is formed surrounding the first insulating layer. The first ring surrounds a fuse area--including the area where the fuse will be cut by a laser or burned by a current. A first dielectric layer is formed over the substrate surface. A first passivation layer is then formed over the first insulating layer. A first opening is formed through the first passivation layer and first dielectric layer over the first ring. A fuse is formed over the first passivation layer over the fuse area and a second ring of water impervious material is formed on the first ring through the first opening. The first and second rings form a moisture impervious seal. A second insulating layer is then formed over the fuse and the first insulating layer. A fuse opening is etched over at least the fuse area through the second insulating layer and can expose the fuse. A second passivation layer is formed over the second insulating layer and the fuse.

REFERENCES:
patent: 4536949 (1985-08-01), Takayama
patent: 4628590 (1986-12-01), Udo et al.
patent: 4795720 (1989-01-01), Kawanabe

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