Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-02-14
2006-02-14
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S778000, C257S780000, C257S750000, C257S758000
Reexamination Certificate
active
06998711
ABSTRACT:
A method of forming micro solder balls for use in a C4 process is described. The solder balls are formed by laying down a peel-away photoresist layer, forming holes in the photoresist layer to expose electrical contacts, depositing a solder layer over the photoresist, forming solder areas in the holes and then, using a tape liftoff process to remove the solder layer and photoresist layer while leaving solder areas in the holes. The solder areas are then heated to allow solder balls to form.
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Dickstein , Shapiro, Morin & Oshinsky, LLP
Micro)n Technology, Inc.
Parekh Nitin
LandOfFree
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