Method of forming a metal pattern on an insulating substrate

Details Method of forming a metal pattern on an insulating substrate Method of forming a metal pattern on an insulating substrate

1977-01-21

1978-04-11

Kellogg, Arthur D.

Glass manufacturing

Processes

Fusion bonding of glass to a formed part

65 44, 65 55, 65 59R, 65 59B, C03C 2702

Patent

active

040837106

ABSTRACT:
A first die having a relief pattern is employed to provide predetermined shape and relative positioning for a first plurality of metal strips. A second die is similarly employed for a second plurality of metal strips Without removing the metal strips from the dies, the strips, still in predetermined shape and position, are bonded to opposing surfaces of an insulating substrate. The bonding process includes bringing the dies, and hence, the metal strips, into contact with the opposing surfaces of the insulating substrate. The bonding process may include the application of heat, pressure, and an electrical field across the bonding interfaces, e.g., anodic bonding.

REFERENCES:
patent: 3328145 (1967-06-01), McMillan et al.
patent: 3397278 (1968-08-01), Pomerantz

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