Method of forming a metal line utilizing electroplating

Details Method of forming a metal line utilizing electroplating Method of forming a metal line utilizing electroplating

1998-03-24

2000-04-11

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205183, 205186, 205187, C25D 502

Patent

active

060484454

ABSTRACT:
The invention relates to a method of forming a metal line. A photoresist layer is formed on a substrate and patterned so that a metal part on the substrate is exposed. A metal seed layer is then deposited over the photoresist layer utilizing a directional deposition technique. A portion of the metal seed layer is then removed. A metal plating is then formed on the metal seed layer utilizing a technique selected from the group consisting of electroplating and electroless plating. The photoresist layer is then removed.

REFERENCES:
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patent: 4973388 (1990-11-01), Francois et al.
patent: 5071518 (1991-12-01), Pan
patent: 5679234 (1997-10-01), Imamura
patent: 5685968 (1997-11-01), Hayakawa et al.

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