Method of forming a low-density insulating thermostructural comp

Details Method of forming a low-density insulating thermostructural comp Method of forming a low-density insulating thermostructural comp

1994-09-14

1996-05-07

Ball, Michael W.

Glass manufacturing

Processes

Fusion bonding of glass to a formed part

65 36, C03B 2320

Patent

active

055141986

ABSTRACT:
The material is composed of previously machined glass/SiC skins which is an expanded glass foam cake forming a sandwich structure which is obtained by placing on a rigid support the elements of the sandwich structure, applying a uniformly distributed mechanical pressure to the structure and by heating to structure under air at atmospheric pressure according to a specific heating/cooling cycle aircraft. One application of this product is to load-bearing structures.

REFERENCES:
patent: 3184371 (1965-05-01), Seidl
patent: 4554197 (1985-11-01), Chyung et al.
patent: 4798758 (1989-01-01), Nagano et al.
patent: 4833015 (1989-05-01), Furuuchi et al.
patent: 4992318 (1991-02-01), Gadkaree

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