Method of forming a lift-off layer having controlled adhesion st

Details Method of forming a lift-off layer having controlled adhesion st Method of forming a lift-off layer having controlled adhesion st

1997-01-24

1999-08-31

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205159, 205170, 205183, 205188, 205191, 205198, 205221, 205223, 313309, 313336, 445 47, 445 50, 216 11, 216 40, C25D 502, C25D 554, C25D 510, C23C 2800

Patent

active

059449756

ABSTRACT:
A method of fabricating an emitter plate 12 for use in a field emission device comprising the steps of providing an insulating substrate 18 and forming a first conductive layer 13 on the insulating substrate 18. This is followed by the steps of forming an insulating layer 20 on the first conductive layer 13 and forming a second conductive layer 22 on the insulating layer 20. Then, a plurality of apertures 34 are formed through the second conductive layer 22 and through the insulating layer 20. A lift-off layer 36 is then formed on the second conductive layer 22. The lift-off layer 36 is formed by a plating process wherein the plating bath has a pH between 2.25 and 4.5, and current densities of 1 to 2O mA/cm.sup.2. The method may further comprise depositing conductive material through the plurality of apertures 34 to form a microtip 14 in each of the plurality of apertures 34. The excess deposited conductive material 14' and the lift-off layer 36 are then removed from the second conductive layer 22.

REFERENCES:
patent: 3755704 (1973-08-01), Spindt et al.
patent: 4129482 (1978-12-01), Lash
patent: 4940916 (1990-07-01), Borel et al.
patent: 5194780 (1993-03-01), Meyer
patent: 5225820 (1993-07-01), Clerc
patent: 5394006 (1995-02-01), Liu
patent: 5458520 (1995-10-01), DeMercurio et al.
patent: 5679044 (1997-10-01), Meyer et al.

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