Method of forming a leak proof plasma sprayed interconnection la

Details Method of forming a leak proof plasma sprayed interconnection la Method of forming a leak proof plasma sprayed interconnection la

1994-02-14

1995-02-21

Skapars, Anthony

Chemistry: electrical current producing apparatus, product, and

With pressure equalizing means for liquid immersion operation

429 31, 429 33, 296235, 427115, 427446, H01M 812, B05D 512

Patent

active

053914406

ABSTRACT:
A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La.sub.1-x M.sub.x Cr.sub.1-y N.sub.y O.sub.3, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075-0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO).sub.12. (Al.sub.2 O.sub.3).sub.7 flux particles including Ca and Al dopant, and LaCrO.sub.3 interconnection particles, preferably undoped LaCrO.sub.3, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and, (C) heat treating the interconnection layer at from about 1200.degree. to 1350.degree. C. to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. The electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power.

REFERENCES:
patent: 3330697 (1967-07-01), Pechini
patent: 3823302 (1974-07-01), Muehlberger
patent: 3839618 (1974-10-01), Muehlberger
patent: 4049841 (1977-09-01), Coker et al.
patent: 4395468 (1983-07-01), Isenberg
patent: 4490444 (1984-12-01), Isenberg
patent: 4582766 (1986-04-01), Isenberg et al.
patent: 4597170 (1986-07-01), Isenberg
patent: 4629537 (1986-12-01), Hsu
patent: 4631238 (1986-12-01), Ruka
patent: 4696731 (1987-09-01), Tenhover
patent: 4857420 (1989-08-01), Maricle et al.
patent: 4861345 (1989-08-01), Bowker et al.
patent: 4895576 (1990-01-01), Pal et al.
patent: 5051321 (1991-09-01), Kitagawa et al.
patent: 5064734 (1991-11-01), Nazmy
patent: 5080689 (1992-01-01), Pal et al.
patent: 5085742 (1992-02-01), Dollard et al.
patent: 5106654 (1992-04-01), Isenberg
patent: 5132352 (1992-07-01), Richards et al.
patent: 5143751 (1992-09-01), Richards et al.
Eror, Nicols G. and Anderson, Harlen U., "Polymeric Precursor Synthesis of Ceramic Materials", Mat. Res. Soc. Symp. Proc., vol. 73 (1986) (month not available).

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