Method of forming a leadframe for a semiconductor package

Details Method of forming a leadframe for a semiconductor package Method of forming a leadframe for a semiconductor package

2006-09-12

2006-09-12

Chambliss, Alonzo (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S123000, C029S874000, C257S670000, C257S672000, C257S676000

Reexamination Certificate

active

07105378

ABSTRACT:
A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package.

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