Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-11-07
2006-11-07
Rossi, Jessica (Department: 1733)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S253000, C156S269000
Reexamination Certificate
active
07132033
ABSTRACT:
A method of forming a layered polishing pad is disclosed. The method includes double-laminating a subpad on opposing sides with respective adhesive layers and bonding a polishing pad top layer to the subpad via the upper adhesive layer. The polishing pad optionally includes a window. Because the subpad is double-laminated, an opening can be formed through both the top and bottom adhesive layers as well as the subpad. Thus, when bonded to a top polishing pad layer having a window, the result is a layered polishing pad with a through optical path that does not include an adhesive layer.
REFERENCES:
patent: 5318835 (1994-06-01), Sawamoto et al.
patent: 5413941 (1995-05-01), Koos et al.
patent: 5605760 (1997-02-01), Roberts
patent: 5716687 (1998-02-01), Chumbley et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5897949 (1999-04-01), Luhmann et al.
patent: 6171181 (2001-01-01), Roberts et al.
patent: 6290589 (2001-09-01), Tolles
patent: 6358130 (2002-03-01), Freeman et al.
patent: 6477926 (2002-11-01), Swisher et al.
patent: 6524164 (2003-02-01), Tolles
patent: 6623337 (2003-09-01), Scott et al.
patent: 6676501 (2004-01-01), Beaudry
patent: 2003/0171081 (2003-09-01), Komukai et al.
patent: 2005/0150594 (2005-07-01), Kodaka et al.
Boldizar Mark J.
Gamble Robert T.
Hedrick Vincent Matthew
Lawhorn Jason M.
Saikin Alan H.
Biederman Blake T.
Rohm and Haas Electronic Materials CMP Holdings Inc.
Rossi Jessica
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