Method of forming a laminated ribbon structure and a ribbon stru

Details Method of forming a laminated ribbon structure and a ribbon stru Method of forming a laminated ribbon structure and a ribbon stru

1980-03-03

1982-12-21

Cannon, James C.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having magnetic properties, or preformed fiber orientation...

118412, 136252, 136261, 428620, 428641, 428642, 428646, 428648, 428649, 428900, 428939, 428212, B32B 1504, C23C 100, H01F 104

Patent

active

043650058

ABSTRACT:
A method of forming, by melt-spinning techniques, a laminated ribbon structure consisting, for example, of a semiconductor disposed on a metal ribbon substrate. The substrate may be 10-50 .mu.m thick and the semiconductor may be 10-50 .mu.m thick, for example; typically the ribbon width is about one millimeter to several centimeters.

REFERENCES:
patent: 3089196 (1963-05-01), Knapp et al.
patent: 4229231 (1980-10-01), Witt et al.

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