Method of forming a hybrid printed circuit board

Details Method of forming a hybrid printed circuit board Method of forming a hybrid printed circuit board

1990-05-18

1992-03-24

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

174265, 427 97, H01K 310

Patent

active

050975935

ABSTRACT:
An improved circuit board structure and method of forming the same are provided. The circuit board includes an insulating core and has plated through holes connecting the circuitry on both sides and intermediate layers of the core. A permanent dielectric material is applied on at least one surface of the board covering the circuitry and plated through holes. Vias are formed through the dielectric material and signal lines are formed on the top of the dielectric material connected to the circuitry onto the board through the vias. Additional layers of dielectric material with additional wiring and vias can also be formed for multi-level wiring.

REFERENCES:
patent: 3311966 (1967-04-01), Shaheen et al.
patent: 3335489 (1967-08-01), Grant
patent: 3356786 (1967-12-01), Helms
patent: 3464855 (1969-09-01), Shaheen et al.
patent: 3589004 (1971-06-01), Shaheen
patent: 4179800 (1979-12-01), Takaba et al.
patent: 4211603 (1980-07-01), Reed
patent: 4535388 (1985-08-01), Kraus et al.
patent: 4554405 (1985-11-01), Varker
patent: 4581679 (1986-04-01), Smolley
patent: 4598166 (1986-07-01), Neese

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