Method of forming a housing for an electronic device

Details Method of forming a housing for an electronic device Method of forming a housing for an electronic device

2007-09-06

2009-11-17

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C174S520000, C361S689000

Reexamination Certificate

active

07617596

ABSTRACT:
The described embodiments relate to electronic devices. One exemplary device includes a pair of sidewall components extending between respective top portions and bottom portions, the bottom portions lying in a plane that extends between the bottom portions. The device also includes a bottom component joined with and extending between the bottom portions, wherein the bottom component has a non-loaded disposition relative to the plane and a loaded disposition relative to the plane, and wherein at least a portion of the bottom component is closer to the plane in the loaded disposition than in the non-loaded disposition.

REFERENCES:
patent: 5165770 (1992-11-01), Hahn
patent: 5441337 (1995-08-01), Mazura et al.
patent: 5574251 (1996-11-01), Sevier
patent: 5653020 (1997-08-01), Romano′ et al.
patent: 6042388 (2000-03-01), Tustaniwskyj et al.
patent: 6432750 (2002-08-01), Jeon et al.

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