Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly nonmetal substrate
Patent
1989-07-13
1993-02-02
Beck, Shrive
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly nonmetal substrate
205184, 205206, 205207, 205917, 427123, 427405, 427368, 4273722, 427355, 427367, C25D 554, C25D 500
Patent
active
051835533
ABSTRACT:
The method of forming a high temperature resistant copper coating on a ceramic and/or enamel substrate, includes the steps of chemically depositing a copper layer having a thickness of at least 3 .mu.m on the substrate, heating the copper layer formed thereon at a temperature of from 200.degree. to 450.degree. C., mechanically treating the copper layer with brush and polishing means to consolidate an upper surface thereof and galvanically depositing an additional copper layer having a thickness of 3 .mu.m on the upper surface. The high temperature resistant copper coating for the ceramic or enamel substrate can stand a higher thermal load for a longer time than similar conventional coatings and can act to rapidly dissipate heat generated by electronic components.
REFERENCES:
patent: 4285782 (1981-08-01), Waldrop et al.
patent: 4748086 (1988-05-01), Akoh
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978 pp. 93-98 and p. 194.
Bock Martin
Heymann Kurt
Rimkus Martin
Tenbrink Detlef
Beck Shrive
King Roy V.
Schering Aktiengesellschaft
Striker Michael J.
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