Method of forming a hermetically sealed circuit lead-on package

Details Method of forming a hermetically sealed circuit lead-on package Method of forming a hermetically sealed circuit lead-on package

1997-02-11

1998-07-21

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438125, H01L 2160

Patent

active

057834644

ABSTRACT:
A hermetically sealed ceramic integrated circuit package and method for achieving same, the package including an internal lead frame attached to an integrated circuit die in a lead-on-chip configuration, an external lead frame attached to the package exterior in a lead-on-package configuration and a high temperature adhesive layer which attaches the internal lead frame to the integrated circuit die.

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