Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Reexamination Certificate
2006-09-19
2006-09-19
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
C257S459000
Reexamination Certificate
active
07109571
ABSTRACT:
A semiconductor die is formed in a process that forms a trench opening in the semiconductor material prior to the formation of the contacts and the metal-1 layer. When contacts are then formed to contact circuit structures, such as a doped region in the top surface of the semiconductor material, a trench contact is formed that fills up the trench opening. During the final steps of the process, the back side of the semiconductor material is ground down to expose the trench contact. The wafer is cut to form a plurality of dice, and the exposed edges of the dice are protected.
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Padmanabhan Gobi R.
Yegnashankaran Visvamohan
National Semiconductor Corporation
Pickering Mark C.
Potter Roy
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