Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-12-30
1996-05-07
King, Roy V.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
427249, 4272557, 427577, 427580, B32B 3100, H05H 148
Patent
active
055142427
ABSTRACT:
A method for forming a heat-sinked electronic component includes the following steps: depositing, at a first deposition rate, a first layer of synthetic diamond having a relatively high thermal conductivity; depositing, on the first layer, at a second deposition rate that is higher than the first deposition rate, a second layer of synthetic diamond having a relatively low thermal conductivity; and mounting an electronic component on the first layer of synthetic diamond. Alternatively, the layers may be deposited in the opposite order.
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Abstract (Dialog) From Diamond Film Update of Jun. 16, 1994 --"CVD Diamond Film Without Stress Cracks" (1 sheet) from Surface Modification Technology News May 1994.
King Roy V.
Novack Martin M.
Saint Gobain/Norton Industrial Ceramics Corporation
Ulbrich Volker R.
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