Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Reexamination Certificate
2000-06-12
2001-05-01
Pianalto, Bernard (Department: 1762)
Coating processes
Direct application of electrical, magnetic, wave, or...
Pretreatment of substrate or post-treatment of coated substrate
C427S207100, C427S322000, C427S393500, C427S404000, C427S412100, C427S544000, C427S591000
Reexamination Certificate
active
06224951
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to flexible circuits, and more particularly, to a flexible laminate for use in forming a flexible circuit.
BACKGROUND OF THE INVENTION
Flexible circuits find advantageous application where an electrical connector/conductor is subject to vibration or movement. Flexible circuits are generally comprised of a polymeric substrate having a copper circuit formed thereon. The electric circuit is generally formed from a continuous layer of copper electrodeposited onto one side of the polymeric substrate. In some instances, it may be desirable to be able to adhere the flexible circuit onto a support surface, or to attach two flexible circuits together with an intermediate insulating layer between the two circuits.
The present invention provides a flexible circuit component for use in forming flexible circuits and a flexible circuit that may be attached to another surface.
SUMMARY OF THE INVENTION
In accordance with the present invention, there is provided a method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of: a) depositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having at least one layer of metal on one side thereof; b) modifying a second side of the polyimide strip to increase the surface energy thereof; c) applying an adhesive onto the second side of the generally continuous strip of polyimide, the adhesive being formed of a substantially uncured, polymeric material, the polymeric material having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface; and d) curing the adhesive wherein at least an outermost layer of the adhesive is only partially cured.
In accordance with another aspect of the present invention, there is provided a method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of: a) depositing a continuous layer of copper on a first side of a generally continuous strip of polyimide film having a layer of metal on the first side; b) exposing a second side of the polyimide film to a chemical plasma at sufficient levels to modify the surface energy of the polyimide film; c) applying at least one layer of metal to the second side of the polyimide film; d) applying an adhesive onto the at least one layer of metal on the second side of the polyimide film, the adhesive being formed of a substantially uncured, polymeric material, the polymeric material having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface; and e) inductively heating the polyimide film to cure the adhesive, wherein at least an outermost region of the adhesive is only partially cured.
In accordance with a further aspect of the present invention, there is provided a method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of: modifying a first side and a second side of a generally continuous polyimide strip to increase the surface energy thereof; depositing a continuous layer of copper on the first side of the generally continuous strip of polyimide film, the first side having at least one layer of metal thereon; applying an adhesive onto the second side of the generally continuous strip of polyimide, the adhesive being formed of a substantially uncured, polymeric material, the polymeric material having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface; and curing the adhesive wherein at least an outermost region of the adhesive is only partially cured.
It is an object of the present invention to provide a flexible laminate for use in forming flexible circuits.
Another object of the present invention is to provide a flexible laminate as described above wherein one side of the flexible laminate includes an at least partially uncured adhesive film.
Another object of the present invention is to provide a flexible laminate as described above wherein the laminate is comprised of a polymeric layer having a layer of copper adhered to one side of the polymeric substrate, and a layer of a polymeric adhesive applied to a second side of the polymeric substrate.
A still further object of the present invention is to provide a flexible laminate as described above wherein the polymeric adhesive is a dimensionally stable film of an uncured polymeric adhesive.
A still further object of the present invention is to provide a method of adhering a polymeric adhesive film to a polymeric substrate.
An even further object of the present invention is to provide a method as described above wherein the method includes the step of surface-treating the polymeric substrate to increase the surface energy thereof.
These and other objects and advantages will become apparent from the following description of preferred embodiments of the invention, taken together with the accompanying drawings.
REFERENCES:
patent: 3985604 (1976-10-01), Balla
patent: 4337279 (1982-06-01), Polak
patent: 4863808 (1989-09-01), Sallo
patent: 5130192 (1992-07-01), Takabayashi et al.
patent: 5242562 (1993-09-01), Beyerle et al.
patent: 5473118 (1995-12-01), Fukutake et al.
patent: 5589280 (1996-12-01), Gibbons et al.
patent: 5681443 (1997-10-01), Ameen et al.
U.S. application No. 09/266,951, Tad Bergstresser et al., filed Mar. 12, 1999, entitled: Laminate for Multi-Layer Printed Circuit.
Centanni Michael A.
Kusner Mark
Centanni Michael A.
GA-TEK Inc. (dba Gould Electronics Inc.)
Kushner Mark
Pianalto Bernard
LandOfFree
Method of forming a flexible laminate for flexible circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming a flexible laminate for flexible circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming a flexible laminate for flexible circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2536070